Friday, June 15, 2012

Technical Program Manager (Mechanical Design) (Metrology, Thermodynamics, Mechanics, Thermal, FEA, CFD)(#108281)

Position: Technical Program Manager (Mechanical Design)
Location: Milpitas, CA
Duration: Full time

Job Description:
The successful candidate will lead the SensArray product development (PLC) team as well as directly manage a small team of talented mechanical engineers. The ideal candidate will provide technical leadership, strong people/project management, as well as being able to contribute at the design level.  He/She must be able to work in a time-critical environment to ensure commitments are met. He/She must effectively grow and develop the team members. He/She must have the ability to work across groups including marketing, applications and manufacturing on all aspects of the development project.

The job requires an in-depth knowledge of product development, metrology technology, thermodynamics, mechanics, and semiconductor component packaging
.

Responsibilities include:
1) 3+ years of experience driving a multifunction product development (PLC) team.
2) 5+ years of experience directly managing a team of engineers in developing hardware.
3) Track record of managing hardware projects for semiconductor industry that met performance requirements, release schedules and program cost.
4) Strong experience with product development best practices - requirements definition, design, development, test, and release.
5) Strong modeling experience - Thermal, FEA, CFD.
6) Ability to effectively work with his/her group spanning across worldwide development centers.
7) Track record of attracting, developing and retaining talent.
8) Create and execute to aggressive project plans.
9) Manage project budgets.
10) Champion and drive new technologies, techniques, or methods.
11) Ability to translate strategic plans into executable roadmaps.
12) Very well organized; a team player.
13) Excellent verbal and written communication skills


Preferred Qualifications:
5+ year’s management experience.
3+ year’s product life cycle management experience.
Experience in semiconductor device packaging.

Basic Qualifications:
Doctorate (Academic) with at least 5 years of experience.
OR
Master's Level Degree with at least 6 years of experience.
OR
Bachelor's Level Degree with at least 7 years of experience.


Kindly send your resumes to
Sivaram.bose@kla-tencor.com